Electronics encapsulation
arrow_backTo the overviewEncapsulation of electronics is an efficient way to protect individual elements from the influence of external environment. The assembled electronic modules are placed in the enclosure and filled with resin to the appropriate height of the module to cover and protect all elements of the electronic system.
The main role of this process is to flood pre-defined or positioned elements with liquid, which is left until the resin sets and the filler is completely cured. The result of this process is a hermetic construction that is integrally bound together with the housing.
This product is added by:
Nordes Sp z o.o.
Nordes sp. z o.o. has been operating in the EMS market for over a decade and is one of the leading Polish companies in the sector of electronics manufacturing. From small, niche products to large, serial products, Nordes offers a complex approach to all types of projects. By partnering with Nordes, you can expect continuous support, advice, and timely deliveries of goods and services. Watch this video presentation to learn more about Nordes: https://www.youtube.com/@nordesems and come to visit our stand 9834 at EOT.
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