Manufacturing
arrow_backTo the overviewCORE TECHNOLOGIES
Surface-mount technologies (SMT), through-hole assembly, microelectronics, Automated Press-Fit, Automated Optical Inspection (AOI), 3D X-ray, clean rooms, wave and selective soldering, cleaning and coating process for PCBs, and Potting & Curing, Hi-Pot, together with FCT, ICT, Burn-In, vibration and environmental testing, mechanical box-build and high-level complex assemblies.
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